About CEMIM 2027
The 2027 3rd International Conference on Engineering Mechanics and Intelligent Manufacturing (CEMIM 2027) is scheduled to be held from July 23 to 25, 2027, in Hulun Buir, China. This conference aims to provide an important platform for professionals from both academia and industry in the fields of engineering mechanics and intelligent manufacturing to exchange innovative ideas, showcase the latest research achievements, and discuss future development trends.
Against the backdrop of the global transformation and upgrading of manufacturing industries, engineering mechanics and intelligent manufacturing are increasingly becoming key drivers of technological advancement and economic growth. CEMIM 2027 will focus on a range of cutting-edge topics including smart materials, advanced manufacturing processes, mechanical system dynamics, structural health monitoring, and intelligent control systems, facilitating in-depth discussions and extensive exchanges.
We sincerely invite distinguished scholars and industry leaders from around the world to gather in Lijiang to share their latest research progress and technological applications, promoting interdisciplinary and cross-industry collaboration and innovation, and jointly advancing the progress and development of the fields of engineering mechanics and intelligent manufacturing.
Important Dates
Full Paper Submission Date: May 24, 2027
Notification of Acceptance: June 23, 2027
Registration Deadline: July 8, 2027
Conference Dates: July 23-25, 2027
Countdown to the Conference:
Conference Topics
The topics of interest for submission include, but are not limited to:
📚︎Engineering Mechanics
Computational Mechanics; Damage and Fracture Mechanics; Dynamics; Elasticity; Experimental Analysis & Instrumentation; Fluid Dynamics; Mechanics of Materials; Modeling Inelasticity and Multiscale Behavior; Multiscale and Multiphysics; Nanomechanics and Micromechanics; Objective Resilience; Poromechanics; Stability
📚︎Intelligent Manufacturing
Joining Processes / Machining; Rapid Manufacturing Technologies; Engine Manufacturing; Wire and Cable Manufacturing Technology; Nanofabrication, Nanometrology and Applications; Nanomanufacturing; Laser-Based Manufacturing; Internal Combustion Engine Manufacturing and Repair; Communication Signal Equipment Manufacturing; Meso/Micro Manufacturing Equipment and Processes; Modeling, Analysis, and Simulation of Manufacturing Processes; Precision Molding Processes; Metrology and Measurement; Mold Design and Manufacturing; Semiconductor Materials Manufacturing
Publication
All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus for indexing.
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📚︎Ei Compendex |
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Note: All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.
